[EMC2]

Smaller feature size - definitely.
Lower Vcore (stock) - probably.
Smaller die size - probably.
Higher transistor count - {maybe}
Higher frequency of operation - definitely.

Lower Vcore helps reduce power.
Smaller Die size makes it harder to conduct the thermal energy to the block.
Higher transistor count means more power.
Higher frequency of operation means more power.

End result - impossible to call at this point and speculative.

{Another big unknown - the "heat spreader". If done right it can help - if done poorly (P4 is an example) it hurts.}

{editted - was thinking claw, so transistor count and spreader comments don't apply to the breads, everything else still applicable}