Quote:
Originally posted by Mr Evil
2) I don't think variations in thermal interface are a problem. I remount the waterblocks between each test, and I see very little change in the results. Also, a thermal pad has a relatively high thermal resistance (about 1.5C/W for one that size?) which would need to be measured and subtracted from what I measure.
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I was thinking the only reason he suggested the pads was because they are more consistant than paste. After all, (i could have mis-read, or be confusing threads) but aren't you trying to see how different cannels/patterns effect performance? What difference does it make if the bock is warmer? The concern I had was not so much their thermal resistance, but that, in my exp. they aren't as touchy. i.e. adding a bigger fan to a HS with a pad may drop temps a degree C, but adding the same bigger fan to the same HS using paste may drop it 5C. Then again, what fun is doing this if your working with warmer temps.
