Correct Gogo

The reason I suggested a thermal pad is for
consistency reasons in your testing. The newer thermal foams give extremely repeatable and consistant results when used properly (controlled by
contact pressure). They also conform to surface contours very well, helping eliminate inconsistencies caused by surface features.
From a recent work project, some of the best currently available materials are available from
Thermagon. In your case, either their T-Pli or T-Flex series would work well

(depends on the how much pressure your test devices can handle. The T-Flex line is VERY good if you need low pressures and/or something that conforms extremely well to surface undulations and would be my suggested type.) (Note also the thermal impedance goes down with increased pressure).
Some numbers -
T-flex 620 @ 10PSI - 0.46 C-in^2/W
T-Flex 620 @ 50PSI - 0.30 C-in^2/W
T-Pli 210 @ 10PSI - 0.18 C-in^2/W
T-Pli 210 @ 10PSI - 0.13 C-in^2/W
You can get complete spec sheets on the stuff from their website, with complete curves of Thermal Impedance versus mounting pressures for the various thicknesses (go to their Data Table link for the curves). Oh - and their #%^_+@! site only works properly with IE.