Les: Oops. That bit should have said "an improvement of just over 0.1oCW-1." (from 0.74 to 0.63).
At the moment, all I have done to insulate the heat source is mount it on a thick piece of glass, which stops heat escaping backwards. The sides of the heat source are still exposed. I should make an insulating gasket I suppose.
gogo/EMC2: I see what you mean. You want consistency between different blocks, which may have slightly different mounting surfaces. The problem is that if I use a pad, I have to know what its thermal resistance is and subtract it from my measurements, whereas with ASII I am happy to leave it in because it reflects the total thermal resistance that affects a CPU. Also, as you said, the consistency of thermal pads requires consistent pressure. I do not have a means of measuring mounting pressure.
edit: Arghhh! HTML is turned off! How am I supposed to do superscript?
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