"ALL" the compound will never leak out.
The purpose of AS and other thermal compounds is not to provide a thick buffer between the cpu die and the heatsink, but rather provide the best thermal transfer with the least resistance, meaning apply only a THING layer. AS is built from the ground up to fill in those microscopic gaps which is what makes it perform so well.
general rule of thumb: don't follow the american way/ideal in which excessiveness is best when dealing with a thermal interface.
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What a chump.
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