EXACTLY! A thinner, more fluid compound would work better because there are fewer and smaller air gaps to fill. If you had a liquid compound you'd use almost nothing at all because it would practically soak into the cracks leaving the excess to run away. Same thing, though, you're basically using a smaller amount of compound due to more metal on die contact (which is ideal).
BTW, if anybody knows of any liquid thermal compound that sets over time (like super glue), let me know, cos I'll be first in line to buy it.
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