BB2K:
You had the answer on that site from the beginning !
Quote:
"
The flatter the mating surfaces, the thinner the layer that is required. Stock processors and/or heatsinks with normal surface irregularities will require a layer 0.003" to 0.005 thick as shown below to fill the resultant gaps. (Equal to the thickness of about 1 sheet of standard weight paper.) Properly lapped heatsinks with mirror finishes will only require a translucent haze.
"
To the last sentence one may add "together with a properly lapped chip".
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