IMHO, this would be great for a totally different reason.
Firstly, even after electoplating (or anodizing) i'd still lap the surface. Oh and i'd lap it BEFORE so i'm sure that the geometry is alright. The 2nd pass would only be with 1200 grit minimum, to avoid getting through the plating itself, and only to get rid of small imperfections which grew up with the plating process.
Next, i think it's a very good idea for thermal reasons. The thermal diffusivity of copper is not as great as silver, this means the core 'hot spot' is very localized. The silver plating would help "spreading" that hot spot further through the block baseplate, with obviously benefic results.
Note the conditional, i'm just guessing. And one would need to determine the ideal plating thickness for optimal thermal diffusion.
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