perhaps reference is being made to Aesik's 'calculator' (as I call it)
which is very much in a prototype phase; it should not be used to quantify differences - rather it is 'illustrative'
bear also in mind that as 'we' characterize thermal impedance with the (hack) "C/W"
- which includes also the TIM joint
the temp diff between Al and Cu is directly related to the applied load
N.B. the applied load is NOT "W" from Radiate (for example) as "W" is overstated AND not corrected to reflect the secondary path heat dissipation
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