Most definately the comparison would not be a good one. The spread of heat in copper is so much greater that what is needed for a good spread in aluminum is drastically different than in copper. Just take the base thickness as an example, then there is the dimensions of any geometry above the base thickness. The heat spread characteristics of the two would make any comparison be like apples to oranges in an equally dimensioned design comparison. Remember the die sizes of the cpus are small to begin with so heat spread is extremely important. Prototyping in aluminum to get a model can be of use but then you could use plastic also to make a model cheap and easy.
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