Congrats on great work and engineering Cathar, but for good evaluation and comparison you definetly need better way of describing block performance then higest overclock, which is good in own way and tells a story pretty well, but I would rather see, temp measured with internal diode. Now are you absolutely sure that you used same clamping force for C5 and yours? What about thermal paste layer, I know that you have lots of experience but just need to know, that difference can easily fall in variance of those two factors. As for thickness, I also think that 1.25 may be to little, this was calculated with your simulator right? It would be good to see exactly inner geometry of the block, but using 3mm base, I know that most of the heat transfer happen directly above the core, but still,heat will spread across the block and other parts of the block would definetly help cooling.
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