Quote:
Originally posted by gone_fishin
The transfer rate of copper does not change but the cunduction path is shortened by the thinner baseplate.
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Energy stored in the baseplate is what determines the heat of the die, if it balances out at a lower temp in the baseplate then the die will be cooler.
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Agreed
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That was in a different block and the tradeoff was in the negative direction for that design, higher overall flow was more beneficial.
A restriction is built into the base of my EQ design which increases the velocity at the center of the bp.
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Agreed. Because the conduction path is shortened, there is a higher delta T between the copper, and the coolant, which results in better performance, IF the coolant/fin combination can take the heat away that fast.
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Agreed, see above.
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So you don't have any flexibility, in case there's room for improvement. That's OK, I'm sure your block performs nicely.
I really need to take the time to finish my #2 design, then I'll need someone to mill it for me...