It's true ain't it?. the way I see it is you want to remove the heat from the CPU as it's occuring, you don't want the heat being 'stored' in the blocks mass, and cooling heat that was produced 5seconds/whatever ago...
You could always have the core area with an ultra thin layer, and let the rest be abit thicker for strenght/integrety.
How small/large an area do you think you could get away with being 1mm or less?, without the need for fins or pins reaching from the base to the top plate for support?. 5mm around the edge of the CPU's footprint?...
PS. is there a way of milling a slope/gradient?, without steps?...
PPS. why don't more people cool direct die?, I'd have thought jetting water onto the die directly would be the ultimate???, perhaps make a Die~sized mini plate of Cu to stick somehow to the die, very thin(thinner than a block would hold up to) but with ridges/channels/whatever to increase surface area...
Last edited by MadDogMe; 10-09-2002 at 08:25 AM.
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