Thread: Thermal paste
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Unread 10-09-2002, 10:22 AM   #8
myv65
Cooling Savant
 
Join Date: May 2002
Location: home
Posts: 365
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Quote:
Originally posted by MadDogMe
I found AS2 used to migrate within two months anyway :shrug: , so I'm a little more 'liberal' now than I used to be . I hav'nt had a chance to try AS3 yet, I brought a tube but it 'migrated' off the shelf it was on into my wastepaper basket!(along with my nylon block mounting stuff and springs) (I found out two weeks later!!) . but they say the migrating's fixed with AS3. anyone had a look~see?...
PS. would 24lbs equate to 6lbs on each corner?, or does it not work like that?...
I've got systems that have run in excess of one year without issue using ASII. I take care to blow the dust out now and then, but nothing more. I have noticed odd patterns on both the chip packaging and heat sink base outside of the die region that could be described as "ghosting". These appear to be the result of some volatile component of the ASII, but haven't changed performance by my reackoning.

As to you "PS", the answer is yes if the 24 pounds is centered within the "box" defined by your corners.
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