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gone_fishin · 10-14-2002, 01:56 AM

It's intended purpose is a TIM where two surfaces mate. One interesting description of a use is "flip chip to lid". Could that be something like the TIM used in the IHS on p4's and future AMD processors?

10-14-2002, 01:56 AM	#7
gone_fishin Cooling Savant Join Date: May 2002 Location: Da UP Posts: 517	It's intended purpose is a TIM where two surfaces mate. One interesting description of a use is "flip chip to lid". Could that be something like the TIM used in the IHS on p4's and future AMD processors?