years ago I was a QC Supervisor at a co. called Signetics when LSI was just starting
the (much smaller then) wafers were FLAT
they are FLAT today
(the etching and subsequent vapor deposition notwithstanding)
the individual (CPU) dies are from scored FLAT wafers
the CPUs are therefore also very FLAT
I believe that anything you could do would make them less flat
I suggest accepting that the die is as it is
BTW, my heat die is copper and refinishing it's surface is a royal PITA
(had to make a 2in. sq. plate to stabilize it during lapping)
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