not sure I would agree with JoeK's whys,
but I too think there may be some clouds on watercooling's horizon
consider the impending advent of AMD IHSs (P4s already have such of course),
and the very high (100lbf ?) clamping loads
the IHS, while designed to protect the chip, will to some extent radially diffuse some of the CPUs heat; while at the same time reduce quantitatively the maximum temperature that the wb bp can see due to the thermal impedance of the additional TIM joint
and
the very high clamping loads (in conjunction with the larger surface of the IHS) will preclude the trend towards thinner bps
these 2 factors will likely cause the 'top performers' to be even more tightly grouped than at present
and
limit the OCing advantage now attributed to WCing
I don't OC so have NO DATA (dare I admit such ?)
what I would very much like to see (pHaestus ? JoeK ?)
is a test of a P4 that is benchmarked while the CPU is held at different temperatures
or has this already been done and I don't know where to find it ?
addendum: bladerunner's work is an inspiration to WCers
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