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Originally posted by Skulemate
Not to rain on anyone's parade, but I thought that the P4 IHS was supposed to be raised in the middle... and that it flattened out with proper clamping force. :shrug:
Oh well, so long as your temperatures improved.
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I have heard that before, but I have not seen the Intel source of that info. Has anyone seen Intel actually give this info? Don't take it personally, but I do not see how Intel would design something like that. There would have to be an air gap or something under the IHS, on top of the CPU, in order for it to flatten out while clamped. The sides would then also have to move outward to some extent to compensate for the flex, and I don't see that happening either.