Light speed!, wonder what the Mhz equivilent is
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I think they're be CPU's designed for DD H20 cooling soon, micros channeled/bored perforated cores for high pressure/velocity mega cooling...
I think if you could make a wafer thin Cu 'plate' with 0.5mm^ channels it'd do direct die cooling some good, it might not technicaly be 'direct die' then, but imagine double the surface area!, TIM layer is the setback though, you'd have to epoxy it as you'd not be able to put any pressure on it to bear...