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I don't see that being accurate. I am talking about AL and Cu. You would have to have a perfect joint between the block and CPU and a block material that conducts 100% efficent for this to be true. It is impossible to get to ambient or even close (close meaning 3Cish or better with modern CPU's). But there has to be a barrier that maxes out the Cu/AL capabilites and it stops accepting more heat.
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It all comes down to thickness, a 1mm Cu base will conduct heat to the H2o more efficiently than a 1cm thick base yes?, it all depends on the design of the block, reaching ambient is the only
real benchmark we have, it's not so much copper stops accepting heat, it's water stops accepting heat from the copper(not enough surface area, design again). Cu will carry on passing heat as long as it has somewhere to go, or until melting point is reached.
Reaching ambient(within a fraction of a Degree) should'nt be impossible, removing the heat from the water and passing it back through the CPU at ambient is another matter
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