g_f
sorry to hop back into the P4 sanding subject, but several of you might be interested
the IHS is the Marketing Dept.'s name for a CPU protective cap
made of thin copper, nickel plated after forming for corrosion resistance (discoloration), adhesively bonded to the package perimeter with epoxy
-> the protection is afforded by the relatively stiff perimeter which is lower than the central area and serves to limit the application of off-axis (angular) loading of the CPU
the 'IHS' is too thin to contribute significantly to lateral heat dispersion (run the calcs - Waterloo),
and is designed to deflect under the applied load from the spec hsf to a 'flat' plane
-> under the 'IHS' is a PCM insert, there is a 40°F offset due to the IHS plus PCM
(Intel is willing to take this ‘hit’ for the protection afforded by the ‘IHS’)
this info from an ex-Intel thermal engr with whom I have some dealings
now consider what the effect is of sanding 'off' that bump in the center of the IHS
-> instead of a somewhat concentrated load over the CPU area, the load is distributed and born also by the edges that were intended merely to stabilize the hsf
-> the compressive load on the PCM is significantly reduced and . . . .
stretch a bit, read up on what PCMs need to work well, temperature and . . . pressure !!
I’m sure everyone will report lower CPU temps after sanding,
because we see that which we wish to see
- no one here read the article about the DIYers who know more than Intel ?
mercy, tough crowd here
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