It hit me in the face. What I observed (large goop around the core) is not a bad thing. What do I mean? The IHS is thin and pliable. So? the portion above the core is stiff because of the core underneath. So? The thicker application of goop is forced away from the center because there is no give there but as it collects around the core from the mounting presure, the unsupported region around the core will give way. If you follow then a thicker application will result in a thicker collection of goop around the core area and bend the IHS under the mounting presure and as a result apply more force to the PCM material under the IHS.
Am I deluded or did that make any sense?
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