Don't we see the main problem with cpu cooling here AGAIN?
We have limited space around our cpu, so we can't put the radiator directly on it, instead we use water as a transfering medium to transfer the heat from the cpu to the big radiator (simplified and not counting on all factors).
But now we're even having troubles transfering the heat from the center of the waterblock to the rest of it in order to use contact area in a good way.
Do you get my point? bigben2k had a rather nice design, but not good enough right where it counts. As I see it, the best design to use in the middle of the chip would be fins in a row, like the heatsinks om grapic cards memory. And that would spoil the whole radius idea. (And would probably be very hard to manufacture with small enough fins)
The main goal must be this: To as fast as possible transfer all heat from the center of the block, to a bigger surface. The rest of the block, or later, the radiator.
And this obviously can't be done much better with copper than we are already doing.
We must use heatpipes!
(don't you think?)
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