Quote:
Originally posted by unregistered
Les
you will persist in making me think, eh ?
I think your compound model is missing a layer
the source 'q' with it's dimensions - fine
'Layer 1' would be the 1st grease layer
'Layer 2' would be the Copper Cap shim proper
-> a 'Layer 3' is needed for the 2ed grease layer between the Copper Cap and the hsf (or wb), no ?
some questions come to mind re the Compound Channel model . .
as I understand the theory/practice: a thermal offset will be present between 2 discontinous pieces even if swedged under 'perfect' conditions
- perhaps/hopefully small, but still existant
what am I missing here ?
I can see where the 2ed thermal offset would be incrementally smaller than the first due to the slightly lower frontside temp
(so my 2*x is not strictly true, no problem)
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"Layer 1" is missiing, for which I would just add 0.1c/w( 10x10x01mm at 10W/m*m*m ) as per drift of discussion on "TIM joint "C/W" testing" (
http://forums.overclockers.com.au/sh...threadid=67401 ).
I do not think this effects the trend illustated.
Was only drawing attention,yet again, to the possible importance of "spreading resistance".The current trend in wb design seems to me to be disregarding it.
I also have no problem.