koslov
I am headings in a direction that is not (yet) apparent to many people
I am pretty sure that the lapping 'procedures' used by OCers - are all wrong
sure, the surface gets nice and shiny, but it is not flat
- that 'problem' is my goal
then the question becomes 'how much flatness is worthwhile'
re CPUs
I will know eventually how flat they are, and if hand lapping (by any procedure) can make them flatter
- I am not talking about IHS flatness, or lapping
does the risk of lapping a CPU warrant the risk ?
we do not know the potential gain (if any ??), nor really the actual risk
- but if this were a favorable ratio, why would the mfgrs not be doing such ?
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