nice N8
I believe much of your 'finish' commentary bears directly on the highly angular, but apparently flat, surface of the AMD CPUs
I will lap these things to learn about them, but have little reason to believe that a 'system' designed by BillA is going to be better than that of AMD
- quite laughable
I have considered the 'off axis' yet flat surface, but suspect that the spring loading is adequate to compensate for the small angle
and the center loading from a clip eliminates such concerns completely
yes, the viscosity of the grease can be quite relevant
I have had a 9 month internship on goop application techniques, and it ain't over yet
I have found, hang onto your hats, that jiggling the mobo studs, in pairs to and away and diagonally, 2 times, 2 hours after mounting; will produce a drop of between 0.1 and 0.3°C in the die temp
the temp will initially rise, then fall ever more slowly over the next hour or so
(remember that I have 0.01°C resolution)
why does this occur ?
to my mind it is clearly related to the disturbing of the thermal grease 'joint', and the subsequent extrusion of additional grease beyond that which would have occurred without the disruption
I use this 'technique' as a documented part of my testing procedure
- controlling the mounting variables is extraordinarily difficult
Brians256
despide all the twaddle on the 'net, that is a terrible method
guaranteed to produce the 'grassy knoll' in the first image
my 'better way' ??
ues a PSA film to eliminate the gross 'lifting' of the paper (better is a loose grit but much more difficult)
try to lock your arm and shoulder in a fixed position
'sand' only on the forward stroke, lifting the piece clear to return again
do not rotate the piece
|