gmat
I believe you are quite correct,
and I suspect (as stated) that the AMD die surface is expressly designed to promote substrate-to-substrate contact
(as does that Intel spire - in a much cruder fashon, sitting on a sharp post !)
perhaps my focus is misplaced ?
there should, with a FLAT bp, be some very localized deformation over the entire die contact area
- lotsa little tiny indentations (anyone got a good 'scope to look at this - N8 ??)
MY handicap in this area is that I work with 2 polished and flat substrates having the same hardness
so only on my computers are the 'real' conditions apparent
some loose terminology gettin' in the way here
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