It's a form of glue used when populating the bare PCB, it can be a real arse when you want to remove a SMD componant. Depending on the methods used in the contruction of the product, it will either be tacky or hard like Arildite. If you ever plan on doing some rework on a componant that is resined down, be very carefull, that "bubblegum" is sometimes strong enough to hold the centre of the part down whilst the rest/legs snap off around it. (Been there, done that

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P4 1.8a @ 2888MHz 1.85v CPU Load/Idle 55/36oC
256meg PC2100 (generic crap) 2.5-5-3-2 2.65v
Abit BE7 RAID (R.I.P BD7-II)
CPU:MEM 1:1 160MHz
Cheapo Coolmaster HSF
Full Atlantis system under construction