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Since87 · 02-03-2003, 08:34 AM

Some relevant Coeffients of Thermal Expansion

Material CTE (ppm/deg-C)
aluminum 23.0
copper 17.5
solder 25-26
FR4 18-25 (Fiberglass AKA organic substrate)
ceramic ~6
silicon 2.3
underfills 19-35

02-03-2003, 08:34 AM	#5
Since87 Pro/Guru - Uber Mod Join Date: Sep 2002 Location: Indiana Posts: 834	Some relevant Coeffients of Thermal Expansion Material CTE (ppm/deg-C) aluminum 23.0 copper 17.5 solder 25-26 FR4 18-25 (Fiberglass AKA organic substrate) ceramic ~6 silicon 2.3 underfills 19-35