Quote:
Originally posted by bigben2k
Oops, my mistake!
What holds the die to the substrate is what absorbs the coolant.
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yea that's what I suspected too, as well as the "pumping effect"(core physically flexing with changes in heat) that billa metioned in one of his articles sucking in water through failures in that sealant, allowing water to corrode the BGA joint under the die.