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BillA · 01-05-2001, 03:22 PM

I don't think so, Joe
The purpose of the thermal test die is to replicate the SIZE, and to control the heat.
Even if you have a TEC the correct size, controlling the backside would be a bear.

On an older topic, since we've had to hear what Gabe Rouchon supposedly said, let's let him say what he DID say (quoted with his permission):

"I had a conversation with a customer a couple of days ago, and we were discussing the MCW371 (an all aluminum design), and I DID tell this customer to go an buy the silver base product because silver offers a vastly superior thermal conductivity than Aluminum. But that was ONLY referring to the MCW371. The new MCW372 (copper base) is not due out until next month, so I thought it was only fair to send the customer to the best candidate - for now :-)

As to the MCW462, we primarily designed it to accomodate a new generation of TEC's (larger sizes) for AMD processors. I do not believe that any of our competitors have looked into this.. But I am sure they will soon :-)

Performance-wise, I suspect that it will perform significantly better than a smaller block because it has a much larger interface with the cooling fluid. Heat EXCHANGE is the key word here. We are exchanging calories between the processor and the fluid, and the interface efficiency results from a combination of thermal conductivity and surface area. The MCW462 offers 100% more surface area than any other block I am aware of. So for now, we should lead the pack easily.

As to using silver for a base instead of Copper, let's look at numbers :

Absolutely Pure Silver has a thermal conductivity of 419 W/m-K
The high conductivity copper C1010 we use is at 391 W/m-K
The best aluminum alloys hover around 220

Whereas there is an enormous difference between aluminum and copper, the difference between copper and Silver is so small that it absolutely doesn't justify the cost.

There is a real problem in this industry with thermal management. I seriously doubt that silver is the solution."

And I have a recent article on overclockers.com to the same effect: http://www.overclockers.com/articles305/

be cool

[This message has been edited by BillA (edited 01-05-2001).]

01-05-2001, 03:22 PM	#12
BillA CoolingWorks Tech Guy Formerly "Unregistered" Join Date: Dec 2000 Location: Posts: 2,371.493,106 Posts: 4,440	I don't think so, Joe The purpose of the thermal test die is to replicate the SIZE, and to control the heat. Even if you have a TEC the correct size, controlling the backside would be a bear. On an older topic, since we've had to hear what Gabe Rouchon supposedly said, let's let him say what he DID say (quoted with his permission): "I had a conversation with a customer a couple of days ago, and we were discussing the MCW371 (an all aluminum design), and I DID tell this customer to go an buy the silver base product because silver offers a vastly superior thermal conductivity than Aluminum. But that was ONLY referring to the MCW371. The new MCW372 (copper base) is not due out until next month, so I thought it was only fair to send the customer to the best candidate - for now :-) As to the MCW462, we primarily designed it to accomodate a new generation of TEC's (larger sizes) for AMD processors. I do not believe that any of our competitors have looked into this.. But I am sure they will soon :-) Performance-wise, I suspect that it will perform significantly better than a smaller block because it has a much larger interface with the cooling fluid. Heat EXCHANGE is the key word here. We are exchanging calories between the processor and the fluid, and the interface efficiency results from a combination of thermal conductivity and surface area. The MCW462 offers 100% more surface area than any other block I am aware of. So for now, we should lead the pack easily. As to using silver for a base instead of Copper, let's look at numbers : Absolutely Pure Silver has a thermal conductivity of 419 W/m-K The high conductivity copper C1010 we use is at 391 W/m-K The best aluminum alloys hover around 220 Whereas there is an enormous difference between aluminum and copper, the difference between copper and Silver is so small that it absolutely doesn't justify the cost. There is a real problem in this industry with thermal management. I seriously doubt that silver is the solution." And I have a recent article on overclockers.com to the same effect: http://www.overclockers.com/articles305/ be cool [This message has been edited by BillA (edited 01-05-2001).]