You only need copper in direct contact with the processor die. Anywhere else and you'll either be radiating heat into the case, or absorbing case heat into the water. As long as the heatplate has sufficient copper/water area, it will cool well. Check out Unaclockers waterblock comparison; the DD Maze 2 cooled better than the OCWC silver polyblock, but the prototype silver polymaze was equal to the DD block.
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