Quote:
Originally posted by murray13
The biggest advantage to WC is it can transfer more heat away from a heat source than air. The problem is what to do with that heat once you get it away from the source.
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That's not entirely correct. Once the CPU temperature has stabilized for a given load, it's a steady state problem... that is, all of the heat produced by the chip is carried away by the cooling device. It doesn't matter if the device is a heat-sink and fan or a water-cooling loop... all of the heat produced is removed by both. The water simply acts as a medium through which the heat is transported to a much larger heat exchanger than can be readily fit onto the HSF... the net result is really that you're using a much larger surface area to dissipate the heat produced.
Off topic... I'm not sure this is the most appropriate forum for this question... certainly it's not one of the busier areas.