what about if it was a p4 or similar with a heatspreader, you could use the heatspreader as what gets cooled (since intel do a good job at mateing it with the die). That would stop the problems with makeing a tight seal around a small die, and it would not matter if the water impingment wore thru - it would wear thru to the die (but i highly doubt it would get thru all that copper).
And yes, I realise this would not be 'true' direct die cooling.
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