Joe, quite frankly, you're a goon. Admittedly this guy has some problems, but you had a few brain farts criticizing him. #1 epoxying a block is pretty ghetto. But soldering one has it's own limitations... differences in the coefficients of expansion can cause stresses that can crack the bond, possibility (although remote) of galvanic corrosion, etc. #2 (the BIG one) HSF on the block which you claim tries to absorb heat from the ambient surroundings... this is preposterous. You're cooling that water with AMBIENT AIR. The best you can ever hope for in a perfect straight up watercooling system is whatever temperature ambient is.... how in the HELL is a heatsink on top of the block going to "collect" heat you tit!?-it's surrounded by the same ambient the radiator is!!!-In other words, it's just like the other radiator, only at a different point in the system. The _only_ disadvantage of that quirky setup is increasing the heatload of the case. Of course it doesn't do a whole whopping lot of good there either unless a disaster strikes like a pump failure which is certainly possible, but it's not the disaster you make it out to be. In any event Joe, if you aim to keep any respect I'd watch your words more carefully
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