OK guys ... from Swiftech
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Module hot side is directly submersed into the coolant for optimal heat dissipation.
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This means that there is no "hot plate" between the water and the tec. Therefore the mounting pressure for the tec is not valid here. Whether this is effective or not I do not know but others have reported good results.
qwerty57
I do not think so. The reason up to now to use a "hot plate" was to distribute the heat over a larger copper area. Hence the need for clamping pressure that has been documented. With Swiftech's approach, the size of the block matches the tec size. Also, because there are no thermal layers, efficiency should be much better. They are a pretty reliable company.
Therefore, it will be Water --> Tec --> base --> GPU
winewood
I did not attack you (well maybe a little
). That was only because you asked why he wanted to do this, this would not help for anything and never answered his question. Overclocking a 2.66 CPU to 3.2gHz using a chilled system does nothing in most programs also ... but it is fun and creative to get there. Most people think I am nuts for water cooling let alone running -10C coolant!
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Oh.. and pci bus isnt a factor on the new mobo's and graphics
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Oh, can we run the PCI and AGP speeds independently now? I do not think so. AGP is always 2x PCI. That is what I was refering to.
Every one who tweaks knows
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The AGP bus has its own access to the processor outside the pci bus.
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Hope this helps qwerty57 and joemac
and sorry winewood