It is annoying the mobo designers always want to keep trying to re-invent the wheel in areas that don't need any re-invention...... especially when there are plenty of other areas that do.:shrug: If they would just all standardize with two holes at a preset spacing, (like the Abit AMD mobos have it would make life much easier).
The spring clip method I made worked well, but maybe to hard for some to make. Superglue may seem fine and its quite strong up to the point when it suddenly isn't any more... which is the main problem, I personally hate gluing anything, it's just not a pleasing solution, but I had to glue a little block I made for my mobo mosfets recently. I just mixed artic silver epoxy with artic silver 3 paste, (three parts-- one part of each epoxy tube, and one part of AS3). The bond is still strong and across the whole chips surface alos acting as the heat transfer medium, but mixed with the AS3 cut it remains a little rubbery so can be removed if need be later.......... in theory at least. This may not work on some of the newer P4 mobo Northbridge chips that have an exposed core.
You must have had a lot of force on the "U" to pull it out of the mobo
, you don't need CPU sink retention pressure levels for a Northbridge chip that gives out around 5 watts.
I've got an Intel, (Springdale chipset), mobo here atm that has a large passive Northbridge sink and its the worst retention method I've seen so far. it uses wire pins that are soldered into the board in four corners and the sink has been slid over the pins, then the end of the pin flattened to prevent it ever coming off again.............. I know it's not really an issue on a non-overclocking Intel reference mobo, but its still a horrid way to do it imo.
