There are several problems with having a recess machined into the block to fit a die the way you described.
To get proper pressure on the die would require more mounting force to compress the four bumper pads and increased pressure on the corners. I don't think that is a good idea.
The surface mounted devices (SMDs) around the die limit how deep a recess can be made. SMDs are not designed to support any kind of cooling unit wieght or pressure.
AMD dies are notoriously fragile so any misalignment during mounting will chip the die, especially with the close tolerances needed to accomplish the "glove effect".
Finally, if you are able to successfully get it all put together with no damage and it all works, you have created a time bomb! Due to the glove-like fitment of the block and die, any bump of the block will likely break the core, especially any accidental side or twisting motion.
I'll stick with the current flat design and give up any possible miniscule temp reduction improvement
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