[8-Ball]

Actually, winewood, anodising DOES affect thermal properties, since Alumina has a lower thermal conductivity than aluminium. However the thickness of the alumina produced by anodising is so thin that difference is minimal.

But this is not the same as saying it doesn't subtract from thermal properties.


As for the BTMS, we have crossed paths on this before, and while you pursuaded me to be a little more open minded in my "appraisal", I'm not sure the same will happen the second time round.

Might I ask what your personal interest is in this product as you seem to be the only person who will still be defending it even when people have outlined its many weaknesses.

I also understand that this is a prototype, and an updated version may have a better quality of construction, and use copper in place of aluminium, but it is the design concept which is more at fault than the construction materials.


Why is the design a problem? There is one significant flaw in the design, and I will try and address this.


Firstly, an understanding of the operation of a TEC is necessary. (For the benefit of those who aren't sure)

TEC's work by transferring thermal energy from one side of the unit to the other. This is a very inefficient process and requires a large power input from a psu.

When studying the "rating" of a peltier, you will be given a Qmax and deltaTmax.

Qmax - the maximum thermal energy which the peltier can dissipate. This will occur at ZERO degrees temperature difference between the cold side and the hot side.

deltaTmax - this is the maximum temperature difference attainable by the peltier, and will occur with ZERO heat load on the unit.

Neither of these cases is realistic, and we will always be operating somewhere between the two.

So for a given TEC, the lower the heat load, the greater the temperature differential between the hot side and the cold side.

Here in lies the problem.

With this design, there is a large array of fins attached to the cold side of the TEC. Why is this a problem?

This means that the TEC can draw heat away from the ambient air in addition to the heat from the processor, if the cold side gets to much below ambient. The lower the temp of the cold plate below ambient, the more heat will be transferred from the air, and the lower the temperature difference across the TEC, since the heat load is increased.

The result of this is that the cold side is unlikely to get much below ambient temperature. Chances are, it will, but not by much.

However, this will cause condensation to occur on the fins, which will drip straight onto the graphics card when the computer is switched off.

Essentially, it is a VERY inefficient way of using a VERY inefficient heat pump.

8-ball