It's almost as effective, the problem being the heat spreader.
The P4's die is 11.3x11.3mm in size. The heatspreader is 1.27mm (0.05") thick. It's not thick enough to spread the heat very far if the waterblock is doing a really good job at soaking the heat up from the hottest central section.
On P4 systems that are correctly reporting temperatures (some have a weird temperature compression thing going on) the gains are typically about 1C less than that seen on AMD CPU's.
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