Perhaps this material could be thermal epoxied to the top of a CPU, and then this material lapped. (Possibly important to look at differences in coefficient of thermal expansion for PGS and silicon.)
I'm thinking that this stuff, might be able to improve overclocking by spreading heat laterally from hotspots, even if the ondie temperature measurement remains the same, or even increased. (Somewhere I saw a depiction of the thermal gradients across a die, and the hotspots were fairly localized.)
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