What is there "realistically" and "reasonably" is there to do to gain anything from the TIM joint. People at amdmb are swearing by this shin etsu stuff saying it is up to 6C better than AS3.
http://www.amdforums.com/showthread....hreadid=209018 But maybe it has some truth to it.
Anyway I don't see there being to many options especially being we are going to have to start working with heat/load spreaders in the near future anyway. Once those start becoming the norm we can directly cool the spreader itself. Should be plenty of room on it to seal it from the top of the spreader.
Graphite is not going to work simply because you need the molucules to go in the right direction. That would take premade sheets from a factory made to fit on a CPU. I don't see it working any other way. If you mix it into a paste form you can't line up the molucules right. Has to be in a solid 1 layer form designed to move the heat strait from the core to the HS. Therfore it has to be solid, and therefor it would probably shatter if put under the presure of a CPU as graphite is brittle? And then there is this cost issue. How many are going to pay $30 or so for a one off mount to gain maybe a C or 2? I know a few of you freeks will
but I am past that point.
Anyway carry on. All I can get in now. Gotta get some work done here today at work.