Quote:
Originally posted by Cossey3
yes and no, silver is not very reactive so there are several reactions which will precipitate a very fine silver layer. one of these is used as a chemical test by most chemistry students at school. it deposits a very fine silver mirror efect on the inside of the test tube. if you did this over the core it would deposite the same silver layer. if done carefully and slowly it is possible to build up a very high purity layer. then you would need to carefully machine lap it flat. it would take a while and you would have to be careful not to get any impurities in the layer.
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"Precipitate" a silver layer? Do you really believe that the result could produce a silver layer that's well bonded to the die?
We've discussed silver plating, for waterblocks, and came to the conclusion that electroplating silver to a copper base would yield little to no improvements, if any, so I don't see how precipitating silver on the die would be any better :shrug:
It's a wild idea, but I'd like to beat it up some more: there maybe something usefull to get out of it.
If the next step would involve very fine lapping of the silver, couldn't I just very fine lap my copper base instead? I could lap the CPU's die too, would that help?
From my understanding of the joint, there's only about a 5% area of contact, from lapped surfaces, without a TIM joint. The TIM joint helps fill in the crevices, and enables a better contact, but the heat must travel through the thermal paste.
Do you know of any way to improve the contact area, without using a thermal paste?
One thing I never quite understood, is if the thermal paste fills in those crevices, weren't they filled with air, before that? If so, then what happened to the air, once the HSF/WB is layed onto the CPU? If it's still there, isn't it still impeding performance?