I guess you could attempt to mirror lap both the base of the block and the CPU core and mount then direct with no TIM joint. I actually laped a block to a nice polish and mounted it once forgetting to apply the thermal compound and it actually worked pretty good. I imaging if the base was professionaly laped "flat" and the core was lapped "flat" and they both where perfectly smooth it would work well. In fact I might try a half assed version of this again. I got plenty of spare CPU's laying around. I will try to get the core as flat as I can and the base of the block as flat as I can and polish them and then mount them with no compound. I will a do a before and after without compound and see what happens. I will do it on my ECS being it is setup for the Thermocoupler. This might be more realistic then anything else I can think of.
You know the little writting on the older AMD CPU dies and then the little AMD trade mark symbol on the newer AMD CPU dies adds a considerable gap when mounting the HS. I am always able to see the imprint of the symbole and writting. That needs to be removed.
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