Quote:
Originally posted by Groth
Based on their stated '0.015ºCin2/W or less thermal resistance' and a die size of 100 sq. mm, you'd have a TIM thermal impedance of ~0.1 °C/W. About the same as well applied thermal paste.
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Actually on their data page they list thermal impedance (in metric) as "0.006-0.013 °C-cm2/W". Using those numbers and the 80W example above this TIM joint would be between .48 and 1.04 deg C. Much better than well applied grease, by 8x. If I'm overlooking something please correct me.
BB2K: Ok, integrate the WB into the silicon directly. I think I read somewhere that Agilent (used to be part of HP) is looking into doing that using inkjet technology.