Quote:
Originally posted by satanicoo
It would be perfectly atached to the core, with no termal paste, and near perfect heat conductivity.
But still ppl, this is something imposible i think, the temperature would destroy the processor no?
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This doesn't make any sence though. You still have a joint in between the block and the silver thats going to be on top of the processor die? Whats the difference than just putting the block on the processor die as usual? Unless that silver is moleculary bonded to the Die I don't see anything that would resemble a significant gain here. You still have a TIM joint between the silver and the base of the block right? or is this silver supposed to BE the TIM joint somehow?