Basically someone through out the idea of chemically plateing the cpu die with silver. Its actually a simple chemical reaction that results with Silver being deposited onto just about anything around.
If I was going to try this I'd mask off the bridges and anything else on the CPUs surface leaving as much room around the cpu open. Then I'd chemically buld up a thin layer of silver onto the die and surrounding areas. After it go thick enough I'd start to electroplate more silver onto the existing silver until I built up the amount I wanted. This would make the best heatspreader possible. If you were able to build a WB into the silver then you'd have no TIM and probobly the best WB known to man.
Possible Problems...
Silver may not stick to the die
Some of the chemicals used may eat at the die or the CPU
Lapping/maching the new silver may destroy the die
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