Quote:
Originally posted by jaydee116
This doesn't make any sence though. You still have a joint in between the block and the silver thats going to be on top of the processor die? Whats the difference than just putting the block on the processor die as usual? Unless that silver is moleculary bonded to the Die I don't see anything that would resemble a significant gain here. You still have a TIM joint between the silver and the base of the block right? or is this silver supposed to BE the TIM joint somehow?
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the idea is that the way the silver is put on the die there will be no real tim between the die and the silver. so no we have a head spreader that will have a far flatter top than the die did so better contact area