Quote:
Originally posted by Cossey3
the idea is that the way the silver is put on the die there will be no real tim between the die and the silver. so no we have a head spreader that will have a far flatter top than the die did so better contact area
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So how well would this bond to the Die. Which is AL from what I understand. If you put to much pressure on one edge of the silver IHS would it pop off or would the Die pop off the CPU. Then what does it take to do such a thing. Can anyone do it?