[hara]

Originally posted by bigben2k
Thanks for chipping in N8, that's exactly what I've been saying.

I think I'll stick with AS3, unless I find something better. I also ordered a sample of the Thermagon stuff, and the DSM is giving me a hard time about it, because he says it's for "space" application, or where the surfaces are really flat.

Why don't you try this shin etsu stuff.

Another TIM idea I had was to use gold leaf between the CPU and cooler.

The reasons are simple: Gold is a very mallable material and with compression *could* make a good TIM. The leaf is only a few microns thick.

Gold's thermal conductivity isn't bad at all. It is better than aluminium but not quite as good as copper. If you calculate the thermal resistance for that short distance, the difference between it and silver would be negligable IMO.

I saw a thread on [H] once about using al foil. Some people got quite good results since the foil is adaptive. That is why I'm suggesting gold leaf now.